Paras Defence Establishes New Subsidiary for Advanced Semiconductor Packaging

Paras Defence and Space Technologies approved the incorporation of a new subsidiary, Paras Semiconductor, to establish an advanced Outsourced Semiconductor Assembly and Testing (OSAT) facility. This unit will focus on heterogeneous 3D packaging for AI, high-performance computing, networking, and data center applications, aiming to build domestic capabilities in semiconductor packaging and testing. The initiative addresses India's current gap in advanced packaging technology, particularly for strategic electronics and defence needs, supporting system-level integration and energy-efficient chip designs.