Samsung to Use TSMC Technology for Nvidia's Next-Generation Custom Memory Chips
Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory (HBM) chips, marking their first collaboration at this manufacturing stage. Nvidia has requested Samsung, SK Hynix, and Micron Technology to adopt TSMC's process for NVHBM base dies and sixth-generation DRAM technology for core dies. Samsung plans to maintain its in-house production for standard HBM and other custom products while evaluating its foundry capacity if demand exceeds TSMC's.
First-hand measurement across 2 sources
We measured how 2 outlets covered this story. No outlet gave this story a measurable political slant — there is no left–right reading to report. Overall sentiment is neutral (50/100). Lens Score 40/100.
Outlets measured: businessstandard, economictimes. See how each one headlined and framed the same story in the source comparison below.
AI Analysis
Sentiment was consistent across outlets (50–50/100), indicating broadly factual reporting rather than editorialising.
Coverage timeline
economictimes broke this story on 18 Oct, 01:52 pm. Other outlets followed.